Power Module Packaging Market Overview, Merger and Acquisitions, Drivers, Restraints and Industry Forecast By 2032

 The latest research report by Emergen Research, named ‘Global Power Module Packaging Market - Forecast to 2032’, entails a comprehensive review of the global Power Module Packaging Market’s present and future trends. The report gathers viable information on the most established industry players, sales and distribution channels, regional spectrum, estimated market share and size, and revenue estimations over the forecast timeframe. The study is inclusive of a profound analysis of this business sphere focuses on the overall remuneration of the market over the projected period. The study also includes significant information pertinent to the Power Module Packaging Market  industry, particularly the current COVID-19 scenario.

The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.

Key players in the market SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc

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Competitive Terrain:

The Global Power Module Packaging Market  is highly consolidated due to the presence of a large number of companies across this industry. The report discusses the current market standing of these companies, their past performances, demand and supply graph, production and consumption patterns, sales network, distribution channels, and growth opportunities in the market at length.

Market Overview:

The report bifurcates the Power Module Packaging market on the basis of different product types, applications, end-user industries, and key regions of the world where the market has already established its presence. The report accurately offers insights into the supply-demand ratio and production and consumption volume of each segment.

To learn more details about the Global Power Module Packaging Market report, visit @ https://www.emergenresearch.com/industry-report/power-module-packaging-market

Our experienced market research team has provided updated information on the ongoing COVID-19 pandemic and its adverse economic impact in the latter segment of the report.  The coronavirus outbreak has led to drastic changes in the current Power Module Packaging Market  business landscape, limiting the growth opportunities for various manufacturers and buyers for the next few years. Besides making speculations about the market’s post-COVID-19 scenario, the report discusses its existing situation.

Segments Covered in this report are:

  • Power Module Type Outlook (Revenue, USD Billion; 2019-2032)

    • Silicon Carbide (SiC) Module
    • Gallium Nitride (GaN) Module
    • Insulated-Gate Bipolar Transistor (IGBT) Module
    • Field-Effect Transistor (FET) Module
    • Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
    • Others

  • Technology Outlook (Revenue, USD Billion; 2019-2032)

    • Standard Packaging
    • Advanced Packaging
    • Pressure-Contact Modules
    • Others

  • Thermal type Outlook (Revenue, USD Billion; 2019-2032)

    • Liquid-Cooled
    • Air-Cooled
    • Hybrid

Regional Analysis of the Power Module Packaging Market  :

  • North America (U.S., Canada)
  • Europe (U.K., Italy, Germany, France, Rest of EU)
  • Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)
  • Latin America (Chile, Brazil, Argentina, Rest of Latin America)
  • Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)

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Key Questions Answered in the Report:

  • What is the growth rate of the Power Module Packaging Market ? What is the anticipated market valuation of Power Module Packaging Market  industry by 2032?
  • What are the key growth driving and restraining factors of the Power Module Packaging Market ?
  • Who are the prominent players operating in the market? What are the key strategies adopted by these companies?
  • What are the key opportunities and growth prospects of the Power Module Packaging Market industry over the forecast period?
  • Which region is expected to show significant growth in the coming years?

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TOC of the global Power Module Packaging Market report:

Chapter 1, describes the Power Module Packaging Market  Introduction, market overview, product offerings, growth opportunities, market risks, driving forces, and challenges.

Chapter 2, analyzes the key manufacturers of Power Module Packaging Market , along with the sales, revenue, and price of Power Module Packaging Market , in the forecast period.

Chapter 3, studies the competitive situation among the major manufacturers and vendors, with sales, revenue, and market share.

Chapter 4, analyzes the global market by regions, with sales, revenue, and market share of Power Module Packaging Market, for each region, from 2020 to 2032.

Chapters 5, 6, 7, 8 and 9, analyze the Power Module Packaging Market  by type, application, regions, and manufacturers, with sales, revenue, and market share by key countries in these regions…Continued

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